TRI's optimum 3D AOI solution delivers the fastest multi-angle PCB inspection coupled with blue-laser-based true 3D profile measurement for the highest automated optical defect symptoms coverage possible. Combining state-of-the-art software solution and third generation intelligent hardware platform, the TR7500 SIII 3D offers robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
Model | TR7500 SIII 3D |
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Imaging Method | Dynamic Imaging with true 3D profile measurement |
Top Camera | 4 Mpix |
Angle Camera | 1.3 Mpix or 6.5 Mpix (factory setting) |
Imaging Resolution | Optical: 10 µm, 15 µm Laser: 10 μm (optional), 20 μm, 50 μm Note: Factory setting |
Lighting | Multi-phase RGB+W LED |
3D Technology | Single/Dual 3D laser sensors |
3D Inspection Range | 20 mm |