KOKI
S3X58-G803
KOKI | Solder Paste
- Ensures stable and ultra low voiding regardless of component type and reflow profiles.
- Large Sized COmponent. The use of power transitor components is becoming more and more as it can perform variety of functions. Therefore, the discharge of generated gas/voids during reflow has become more critical for such large sized components.
- Crack Propagation. When the component undergoes thermal fatigue, crack at the solder fillet and voids (if present) could cause the fracture of the joint easily.
- Heat Release. One of the important things that power transitor components require is the heat release control for their massive heat buildup. Voids that are remained inside the solder joint could negatively affect the heat conductivuty and could lead to functional inhibition.
| Model | S3X58-G803 |
|---|---|
| Composition | Sn 3.0Ag 0.5Cu |
| Particle Size (μm) | 20-38 |
| Flux Content(%) | 11.8 |
| Flux Type | ROL0（IPC J-STD-004) |
| Product Category | Solder Paste |
| Melting Point (°C) | 217 - 219 |
| Viscosity（Pa.s) | 200 |
| Halide content(%) | 0 |
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